Chuke Intelligent Laser Successfully Validated for Precision Semiconductor Processing
Chongqing Chuke Intelligent Machinery & Equipment Co., Ltd. (hereinafter referred to as "Chuke Intelligent") has successfully completed full-process testing of its flagship laser for cutting silicon carbide (SiC) materials. Designed for the precision processing of hard, brittle third-generation semiconductor substrates—specifically targeting common SiC plate thicknesses of 2mm and 5mm—this laser provides a stable, reliable light source solution for the mass production of SiC power devices and ceramic substrates.
Silicon carbide is a core substrate material in the third-generation semiconductor industry; however, its high hardness and brittleness make it prone to quality defects such as edge chipping, micro-cracks, and dimensional deviations during processing. Traditional diamond cutting processes suffer from high consumable costs and limited efficiency, while conventional general-purpose lasers struggle to balance processing speed with high yields, historically hindering the large-scale production of precision semiconductor components. To address these challenges, Chuke Intelligent launched the YFQCW-450-SM laser, specifically engineered for the ablation cutting of hard, brittle non-metallic materials like silicon carbide and alumina ceramics.
The unit features a compact, all-in-one enclosure equipped with multiple cooling fans, a safety emergency stop button, and a standard fiber-optic output interface, paired with a long-distance transmission fiber. Utilizing a maintenance-free, air-cooled design, the system is suitable for both small-batch laboratory prototyping and direct integration into automated production lines. It delivers excellent beam quality and stable peak power output, with precisely controllable pulse energy; this significantly reduces thermal stress during processing, effectively preventing common issues such as edge chipping, delamination, and cracking at the source.
The entire processing workflow requires no additional auxiliary consumables, and the laser supports stable, continuous operation over extended periods. Compared to traditional mechanical cutting methods, this equipment directly reduces consumable procurement costs and losses associated with product rework. This laser features a concentrated single-mode optical path and precise control over the heat-affected zone, ensuring both processing efficiency and high yield rates for both thin and thick silicon carbide (SiC) substrates. It is also compatible with processes such as drilling, dicing, and complex-shape cutting for semiconductor ceramic substrates—including sapphire and aluminum nitride—making it suitable for a wide range of applications.
Moving forward, Chuke Intelligent will continue to analyze the process data gathered from these tests, refine operational parameters for various equipment configurations, and conduct targeted performance testing on diverse silicon carbide substrates and electronic ceramic materials. Additionally, the company will continue to deliver standardized laser source and cutting process solutions, providing reliable precision processing equipment to clients in the new energy and semiconductor sectors, thereby helping the domestic third-generation semiconductor manufacturing industry improve quality and efficiency while reducing costs.