In the semiconductor packaging and precision device production process, the over furnace carrier is the core fixture to ensure the stability of product sintering and reflow soldering processes. Under long-term high-temperature operation, the surface of the carrier is prone to accumulate stubborn pollutants such as solder residue, flux carbonization layer, and metal oxides. Traditional cleaning methods are not thorough, can damage the substrate, and cause secondary pollution, which has long been an industry pain point affecting semiconductor production accuracy and product yield. In response to this market demand, Chongqing Chuke Intelligent Machinery Equipment Co., Ltd. (hereinafter referred to as "Chuke Intelligent") has launched a 300W pulse laser cleaning machine, which is specially designed to customize cleaning solutions for semiconductor furnace carriers. With efficient, non-destructive, and environmentally friendly technological advantages, it completely solves the problem of carrier cleaning.
Semiconductor furnace carriers operate under high temperature conditions for a long time, and the adhesion of carbide residues and oxides is extremely strong. The drawbacks of ordinary manual wiping, chemical immersion, traditional ultrasonic cleaning, and other methods are prominent. Not only is it difficult to clean blind spots such as corners and micropores of the carrier, but chemical agents can also corrode the precision structure and surface coating of the carrier, causing tooling loss and decreased accuracy. At the same time, waste liquid pollution is generated, increasing the cost of environmental protection treatment for enterprises and seriously restricting the improvement and efficiency of semiconductor precision production.
The initial intelligent 300W pulse laser cleaning machine precisely adheres to the strict clean production standards of the semiconductor industry and adopts advanced non-contact pulse laser cleaning technology. The equipment precisely applies high-energy pulse laser to the surface pollutants of the carrier, utilizing photothermal effect to quickly peel off and remove various stubborn impurities. There is no need to contact the workpiece throughout the process, and it will not cause any damage to the metal substrate, precision hole positions, and original structure of the carrier. Compared to traditional cleaning, the use of laser cleaning machines does not require the addition of any chemical cleaning agents, and there is no secondary pollution such as waste liquid or residue, which meets the requirements of semiconductor dust-free and clean production; Comprehensive and thorough cleaning, laser can accurately cover the surface, gaps, and micro hole dead corners of the carrier, eliminating conventional cleaning blind spots; Efficient and time-saving, the automated operation mode significantly reduces the maintenance time of the load tray, eliminating the need for subsequent drying and repair processes, effectively improving the turnover efficiency of the production line, and reducing the operation and maintenance costs of the enterprise.
At present, the 300W pulse laser cleaning machine has completed multiple rounds of on-site testing, and its cleaning effect for various types of semiconductor furnace carriers is stable and meets the standard. It can efficiently adapt to multiple production scenarios such as semiconductor packaging, power device sintering, SMT reflow soldering, etc. As a domestically produced precision cleaning equipment, this product accurately targets the pain points of industry production. With stable performance and outstanding cleaning effects, it provides semiconductor enterprises with a cost-effective tool cleaning solution.
With the semiconductor industry iterating towards high precision and high reliability, the cleanliness control of production fixtures has become the key to enhancing the core competitiveness of products. Chuke Intelligence has clearly identified semiconductor precision cleaning as its core direction of deep cultivation. In the future, Chuke Intelligence will continue to promote the adaptation and application of laser cleaning technology in more tooling scenarios. With the reliable performance of domestic equipment, it will help the semiconductor industry optimize processes, improve yield, and provide reliable cleaning solutions for precision manufacturing.